To understand the **structure of BJT (Bipolar Junction Transistor)** and **MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor)**, it's important to recognize that both are semiconductor devices used for **amplification and switching**, but they have **different internal structures** and **operating principles**.
---
## **1. Structure of BJT (Bipolar Junction Transistor)**
BJTs come in two main types:
* **NPN**
* **PNP**
### Basic Structure:
A BJT has **three layers of semiconductor material** and **three terminals**:
* **Emitter (E)**
* **Base (B)**
* **Collector (C)**
### NPN Transistor Structure:
```
Collector (C) β N-type
Base (B) β P-type (very thin and lightly doped)
Emitter (E) β N-type (heavily doped)
```
So, the structure is: **N (Collector) β P (Base) β N (Emitter)**
### PNP Transistor Structure:
```
Collector (C) β P-type
Base (B) β N-type
Emitter (E) β P-type
```
So, the structure is: **P (Collector) β N (Base) β P (Emitter)**
### Layer Description:
* **Emitter:** Heavily doped to inject charge carriers (electrons or holes).
* **Base:** Very thin and lightly doped to allow carriers to pass through with minimal recombination.
* **Collector:** Moderately doped and larger area to collect carriers.
### Function:
In an NPN BJT, when a small current flows from **base to emitter**, it allows a much larger current to flow from **collector to emitter**. The transistor is **current-controlled**.
---
## **2. Structure of MOSFET (Metal-Oxide-Semiconductor FET)**
MOSFETs also have **three main terminals**:
* **Source (S)**
* **Drain (D)**
* **Gate (G)**
They come in two types:
* **n-channel MOSFET**
* **p-channel MOSFET**
Each type also has enhancement and depletion mode versions, but here we'll focus on **enhancement mode** (most common).
### Basic Structure:
MOSFETs are built on a **semiconductor substrate** (usually p-type for n-channel MOSFET). The **gate** is insulated from the substrate by a thin **oxide layer** (usually silicon dioxide).
### N-channel MOSFET Structure:
* **Substrate:** P-type
* **Source/Drain:** N-type regions diffused into the substrate
* **Gate:** Metal or polysilicon over a thin SiOβ layer
```
Drain (N+) ββββββ
β
Gate (Metal) β (over thin oxide)
β
Source (N+) ββββββ
|
P-type substrate (Body)
```
The gate is **electrically insulated** from the channel by the oxide. No direct current flows into the gate β instead, **voltage on the gate controls the current** between source and drain.
### Function:
* In an **n-channel enhancement MOSFET**, when you apply a positive voltage to the gate, it attracts electrons toward the surface beneath the oxide, forming a **conductive channel** between the **source** and **drain**.
* The MOSFET is **voltage-controlled**, unlike the BJT which is current-controlled.
---
## **Key Differences in Structure**
| Feature | BJT | MOSFET |
| ----------------- | ---------------------------------------------- | ------------------------------------------ |
| Type | Bipolar device (uses both electrons and holes) | Unipolar device (uses one type of carrier) |
| Terminals | Emitter, Base, Collector | Source, Gate, Drain |
| Control Signal | Base current | Gate voltage |
| Gate/Base | Thin base (BJT) | Insulated gate (MOSFET) |
| Channel formation | Not applicable (fixed junctions) | Channel induced by gate voltage |
| Current Flow | Controlled by base-emitter current | Controlled by gate voltage |
---
## β
Summary
* **BJT** is a **current-controlled** device with a **sandwich structure (NPN or PNP)**. It uses both types of charge carriers and relies on a base current to control collector-emitter current.
* **MOSFET** is a **voltage-controlled** device with a structure involving a **gate oxide layer**, and it uses an electric field to form a channel for current to flow between the source and drain.
Would you like a labeled diagram of each to visualize their structure?